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The Twelfth International Conference on Smart Portable, Wearable, Implantable and Disability-oriented Devices and Systems

SPWID 2026

April 19, 2026 to April 23, 2026 - Lisbon, Portugal

Deadlines

Submission

Jan 07, 2026

Notification

Feb 15, 2026

Registration

Mar 01, 2026

Camera ready

Mar 15, 2026

Deadlines differ for special tracks. Please consult the conference home page for special tracks Call for Papers (if any).

Publication

Published by IARIA Press (operated by Xpert Publishing Services)

Archived in the Open Access IARIA ThinkMind Digital Library

Prints available at Curran Associates, Inc.

Authors of selected papers will be invited to submit extended versions to a IARIA Journal

Indexing Procedure

Affiliated Journals

HOME Call for Papers Committees Touristic Info Hotel and Travel Event Program Tutorials Registration Camera Ready Submit a Paper iaria.org Contact

SPWID 2026 - The Twelfth International Conference on Smart Portable, Wearable, Implantable and Disability-oriented Devices and Systems

April 19, 2026 - April 23, 2026

SPWID 2026: Committees
Onsite and Online Options: In order to accommodate various situations, we are offering the option for either physical presence or virtual participation (pdf slides or pre-recorded videos).

SPWID 2026 Steering Committee

Steve Mann
Stanford University
USA

Mu-Chun Su
National Central University
Taiwan

Andrea Caroppo
National Research Council of Italy (CNR) - Institute for Microelectronics and Microsystems
Italy

  

 

Steve Mann
Stanford University
USA

Mu-Chun Su
National Central University
Taiwan

Andrea Caroppo
National Research Council of Italy (CNR) - Institute for Microelectronics and Microsystems
Italy

 

SPWID 2026 Publicity Chairs

Francisco Javier Díaz Blasco, Universitat Politècnica de València, Spain
Ali Ahmad, Universitat Politècnica de València, Spain
Sandra Viciano Tudela, Universitat Politècnica de València, Spain
José Miguel Jiménez, Universitat Politècnica de València, Spain

 

SPWID 2026 Technical Program Committee

(to be announced)

Technical Co-Sponsors and Logistic Supporters

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