The Twelfth International Conference on Business Intelligence and Technology

BUSTECH 2022

April 24, 2022 to April 28, 2022 - Barcelona, Spain

Deadlines

Submission

Jan 24, 2022

Notification

Feb 20, 2022

Registration

Mar 03, 2022

Camera ready

Mar 10, 2022

Deadlines differ for special tracks. Please consult the conference home page for special tracks Call for Papers (if any).

Publication

Published by IARIA Press (operated by Xpert Publishing Services)

Archived in the Open Access IARIA ThinkMind Digital Library

Prints available at Curran Associates, Inc.

Authors of selected papers will be invited to submit extended versions to a IARIA Journal

Indexing Procedure

Affiliated Journals

BUSTECH 2022 - The Twelfth International Conference on Business Intelligence and Technology

April 24, 2022 - April 28, 2022

BUSTECH 2022: Submit a Contribution
Onsite and Online Options: In order to accommodate a large number of situations, we are offering the option for either physical presence or virtual participation (pdf slides or pre-recorded videos).

Before submitting, please consider that any contribution that is peer-reviewed and accepted is expected to be registered by at least one author

To submit your contribution, fill out the submission form with information about your paper. Please, fill it out only once for each paper, and do not resubmit it. Contact the address below if you run into any difficulties.

As the designated correspondence author, you will then receive a first e-mail message containing the paper ID. The information in the email will allow you to submit your paper.

If you have some problems send your paper via this e-mail (please report your paper ID in the text of your mail AND the name of the conference).

The conference staff will contact you only if the paper does not print properly or has other problems.

You can change information about your paper, submit brief corrections, view an email trail, and even edit your personal information by following the link in the initial confirmation email.

Technical Co-Sponsors and Logistic Supporters