The Eighth International Conference on Smart Portable, Wearable, Implantable and Disability-oriented Devices and Systems

SPWID 2022

June 26, 2022 to June 30, 2022 - Porto, Portugal

Deadlines

Submission

Mar 26, 2022

Notification

Apr 22, 2022

Registration

May 06, 2022

Camera ready

May 10, 2022

Deadlines differ for special tracks. Please consult the conference home page for special tracks Call for Papers (if any).

Publication

Published by IARIA XPS Press

Archived in the free access ThinkMind Digital Library

Prints available at Curran Associates, Inc.

Authors of selected papers will be invited to submit extended versions to a IARIA Journal

Indexing Procedure

Affiliated Journals

SPWID 2022 - The Eighth International Conference on Smart Portable, Wearable, Implantable and Disability-oriented Devices and Systems

June 26, 2022 - June 30, 2022

SPWID 2022: Committees
Onsite and Online Options: In order to accommodate a large number of situations, we are offering the option for either physical presence or virtual participation (pdf slides or pre-recorded videos).

SPWID 2022 Steering Committee

Steve Mann
Stanford University
USA


Mu-Chun Su
National Central University
Taiwan


Andrea Caroppo
National Research Council of Italy (CNR) - Institute for Microelectronics and Microsystems
Italy


 

 

SPWID 2022 Publicity Chairs

José Miguel Jiménez, Universitat Politecnica de Valencia, Spain
Laura Garcia, Universitat Politècnica de València (UPV), Spain

SPWID 2022 Technical Program Committee

Zaid Ahmad, COMSATS University Islamabad, Pakistan
Giovanni Albani, Istituto Auxologico Italiano - IRCCS, Italy
Jesús B. Alonso Hernández, Institute for Technological Development and Innovation in Communications (IDeTIC) | University of Las Palmas de Gran Canaria (ULPGC), Spain
Salzitsa Anastasova-Ivanova, Imperial College London, UK
Danilo Avola, Sapienza University, Rome, Italy
Suhaib Ahmed Batt, Baba Ghulam Shah Badshah University, India
Roberto Beghi, Università degli Studi di Milano, Italy
Juan-Vicente Capella-Hernández, Universitat Politècnica de València, Spain
Andrea Caroppo, National Research Council of Italy (CNR) - Institute for Microelectronics and Microsystems, Italy
Claude Chaudet, Webster University Geneva, Switzerland
Francesco G. Della Corte, University of Napoli Federico II, Italy
Biyi Fang, Microsoft, USA
Shayan Fazeli, UCLA Henry Samueli School of Engineering and Applied Science, USA
Giancarlo Fortino, University of Calabria, Italy
Arfan Ghani, Coventry University, UK
Migyeong Gwak, University of California - Los Angeles (UCLA), USA
Gema Ibáñez, ITACA - Universitat Politècnica de València, Spain
Jk Jensen, Arizona State University, USA
Pradeep Kumar, University of KwaZulu-Natal, Durban, South Africa
Tomas Laurenzo, University of Colorado at Boulder, USA
Alessandro Leone, National Research Council of Italy, Lecce, Italy
Lenka Lhotska, Czech Institute of Informatics, Robotics and Cybernetics | Czech Technical University in Prague, Czech Republic
Cun Li, Eindhoven University of Technology, Netherlands
Tianliang Li, Wuhan University of Technology, China
Federico Magliani, University of Modena and Reggio Emilia, Italy
Steve Mann, Stanford University, USA
Gregory O'Hare, University College Dublin (UCD), Ireland
Ilham El Ouariachi, University Sidi Mohamed Ben Abdellah, Fez, Morocco
Luana Persano, Institute of Nanoscience - CNR, Pisa, Italy
Chinthaka Premachandra, Shibaura Institute of Technology, Japan
Amir Rahmati, Stony Brook University, USA
Chandan Karadagur Ananda Reddy, Microsoft Corp., Redmond, USA
Veronica Mattioli, Univeristy of Parma, Italy
Helder C. R. Oliveira, University of Calgary, Canada
Paulo Pedreiras, DETI/UA/IT, Portugal
Juha Röning, University of Oulu, Finland
Gonzalo Sad, CIFASIS / CONICET / FCEIA | Universidad Nacional de Rosario, Argentina
Pietro Siciliano, Institute for Microelectronics and Microsystems IMM-CNR, Lecce, Italy
Mu-Chun Su, National Central University, Taiwan
Ryszard Tadeusiewicz, AGH University of Science and Technology, Poland
Adrian Tarniceriu, Securecell SA, Switzerland
Carlos M. Travieso-González, University of Las Palmas de Gran Canaria, Spain
Warner ten Kate, Philips Research, Eindhoven, Netherlands
Wang Wen, Institute of Acoustics - Chinese Academy of Sciences, China
Diane Woodbridge, University of San Francisco, USA
Hui Wu, The University of New South Wales, Australia
Murat Kaya Yapici, Sabanci University, Istanbul, Turkey

Technical Co-Sponsors and Logistic Supporters