The Sixteenth International Conference on Advanced Engineering Computing and Applications in Sciences

ADVCOMP 2022

November 13, 2022 to November 17, 2022 - Valencia, Spain

Deadlines

Submission

Jul 16, 2022

Notification

Aug 12, 2022

Registration

Aug 25, 2022

Camera ready

Aug 30, 2022

Deadlines differ for special tracks. Please consult the conference home page for special tracks Call for Papers (if any).

Publication

Published by IARIA Press (operated by Xpert Publishing Services)

Archived in the Open Access IARIA ThinkMind Digital Library

Prints available at Curran Associates, Inc.

Authors of selected papers will be invited to submit extended versions to a IARIA Journal

Indexing Procedure

Affiliated Journals

ADVCOMP 2022 - The Sixteenth International Conference on Advanced Engineering Computing and Applications in Sciences

November 13, 2022 - November 17, 2022

ADVCOMP 2022: Committees
Onsite and Online Options: In order to accommodate a large number of situations, we are offering the option for either physical presence or virtual participation (pdf slides or pre-recorded videos).

ADVCOMP 2022 Steering Committee

Dean Vucinic
Vrije Universiteit Brussel (VUB), Belgium
FERIT, Croatia


Juha Röning
University of Oulu
Finland


Alfred Geiger
T-Systems Information Services GmbH
Germany


Marcin Hojny
AGH University of Science and Technology
Poland


Hans-Joachim Bungartz
TUM
Germany


Alice E. Koniges
University of Hawai‘i at Mānoa
USA


Andreas Rausch
TU Clausthal, Clausthal-Zellerfeld
Germany


ADVCOMP 2022 Publicity Chairs

Mar Parra, Universitat Politecnica de Valencia, Spain
Sandra Viciano Tudela, Universitat Politecnica de Valencia, Spain

ADVCOMP 2022 Technical Program Committee

Waleed H. Abdulla, University of Auckland, New Zealand
José Abellán, Catholic University of Murcia, Spain
Mohamed Riduan Abid, Alakhawayn University, Morocco
Rashmi Agrawal, Manav Rachna International Institute of Research and Studies, India
Francisco Airton Silva, Federal University of Piauí, Brazil
M. Azeem Akbar, Nanjing University of Aeronautics and Astronautics, China
Haifa Alharthi, Saudi Electronic University, Saudi Arabia
Sónia Maria Almeida da Luz, Polytechnic Institute of Leiria - School of Technology and Management, Portugal
Madyan Alsenwi, Kyung Hee University, Global Campus, South Korea
Mohamed E. Aly, California State Polytechnic University, Pomona, USA
Daniel Andresen, Kansas State University, USA
Anindya Das Antar, University of Michigan, USA
Alberto Antonietti, Politecnico di Milano / University of Pavia, Italy
Mansur Arief, Carnegie Mellon University, Pittsburgh, USA
Ehsan Atoofian, Lakehead University, Canada
Vadim Azhmyakov, Universidad Central, Bogota, Republic of Colombia
Carlos Becker Westphall, University of Santa Catarina, Brazil
Raoudha Ben Djemaa, ISITCOM | University of Sousse, Tunisia
Peter Bentley, University College London, UK
Sergiy Bogomolov, Newcastle University, UK
Alessandro Borri, CNR-IASI Biomathematics Laboratory, Rome, Italy
David Bouck-Standen, Kingsbridge Research Center, UK
Sofiane Bououden, University Abbes Laghrour Khenchela, Algeria
Hans-Joachim Bungartz, TUM, Germany
Xiao-Chuan Cai, University of Colorado Boulder, USA
Graziana Cavone, Polytechnic of Bari, Italy
Mete Celik, Erciyes University, Turkey
Jieyang Chen, Oak Ridge National Laboratory, USA
Jinyuan Chen, Louisiana Tech University, USA
Rangeen Basu Roy Chowdhury, Intel Corporation, USA
Vassilios V. Dimakopoulos, University of Ioannina, Greece
Inês Domingues, IPO Porto Research Centre (CI-IPOP), Portugal
Shi Dong, Northeastern University, Boston, USA
Maha Elarbi, University of Tunis, Tunisia
Javier Fabra, Universidad de Zaragoza, Spain
Akemi Galvez, University of Cantabria, Spain / Toho University, Japan
Leonardo Garrido, Tecnologico de Monterrey, Mexico
Alfred Geiger, T-Systems Information Services GmbH, Germany
Tong Geng, Boston University, USA
Jing Gong, KTH Royal Institute of Technology, Sweden
Teofilo Gonzalez, UC Santa Barbara, USA
Bernard Grabot, LGP-ENIT, France
Maki Habib, American University in Cairo, Egypt
Yang He, University of Technology Sydney, Australia
Mohd Helmy Abd Wahab, Universiti Tun Hussein Onn Malaysia, Malaysia
Marcin Hojny, AGH University of Science and Technology, Poland
Wladyslaw Homenda, Warsaw University of Technology, Poland
Tzung-Pei Hong, National University of Kaohsiung, Taiwan
Mehdi Hosseinzadeh, Washington University in St. Louis, USA
Paul Humphreys, Ulster University | Ulster University Business School, UK
Andres Iglesias, University of Cantabria, Spain / Toho University, Japan
Joanna Isabelle Olszewska, University of West Scotland, UK
Hiroshi Ishikawa, Tokyo Metropolitan University, Japan
Félix J. García Clemente, University of Murcia, Spain
Attila Kertesz, University of Szeged, Hungary
Zaheer Khan, University of the West of England, UK
Alice E. Koniges, University of Hawai‘i at Mānoa, USA
Seyong Lee, Oak Ridge National Laboratory, USA
Maurizio Leotta, University of Genova, Italy
Clement Leung, Chinese University of Hong Kong, Shenzhen, China
Yiu-Wing Leung, Hong Kong Baptist University, Hong Kong
Yiheng Liang, Bridgewater State University, USA
Stephane Maag, Telecom SudParis, France
Elbert E. N. Macau, Federal University of Sao Paulo - UNIFESP at Sao Jose dos Campos, Brazil
Marcin Markowski, Wroclaw University of Science and Technology, Poland
Mirko Marras, University of Cagliari, Italy
René Meier, Hochschule Luzern, Switzerland
Mohamed Wiem Mkaouer, Rochester Institute of Technology, USA
Sébastien Monnet, Savoie Mont Blanc University (USMB), France
Shana Moothedath, University of Washington, Seattle, USA
Jaime Moreno, IBM TJ Watson Research Center, USA
Laurent Nana, University of Brest, France
Ehsan Nekouei, City University of Hong Kong, Hong Kong
Kaiming Ouyang, Nvidia, USA
Marcin Paprzycki, Systems Research Institute | Polish Academy of Sciences, Poland
Prantosh Kumar Paul, Raiganj University, India
Damien Pellier, Université Grenoble Alpes, France
Sonia Pérez-Díaz, University of Alcalá, Spain
Antonio Petitti, Institute of Intelligent Industrial Systems and Technologies for Advanced Manufacturing (STIIMA) - National Research Council of Italy (CNR) , Italy
Tamas Pflanzner, University of Szeged, Hungary
Agostino Poggi, Università degli Studi di Parma, Italy
Evgeny Pyshkin, University of Aizu, Japan
Andreas Rausch, Technische Universität Clausthal, Germany
Carlos Reaño, Queen's University Belfast, UK
Michele Risi, University of Salerno, Italy
Michele Roccotelli, Politecnico di Bari, Italy
Ivan Rodero, Rutgers University, USA
Juha Röning, University of Oulu, Finland
Diego P. Ruiz, University of Granada, Spain
Bibhudatta Sahoo, National Institute of Technology, Rourkela, India
Julio Sahuquillo, Universitat Politècnica de València, Spain
Subhash Saini, NASA, USA
Aadesh Salecha, University of Minnesota, USA
Shailaja Sampat, Arizona State University, USA
Hamed Sarvari, George Mason University, USA
Alireza Shahrabi, Glasgow Caledonian University, Scotland, UK
Justin Shi, Temple University, USA
Piotr Sowiński, Systems Research Institute, Polish Academy of Sciences, Poland
Mohammed Tanash, Kansas State University, USA
Costas Vassilakis, University of the Peloponnese, Greece
Bhavan Vasu, Oregon State University, USA
Flavien Vernier, LISTIC – Savoie University, France
Juan Vicente Capella Hernández, Universitat Politècnica de València, Spain
Dean Vucinic, Vrije Universiteit Brussel (VUB), Belgium / FERIT, Croatia
Hanrui Wang, Massachusetts Institute of Technology, USA
Lei Wang, University of Connecticut, USA
Adriano V. Werhli, Universidade Federal do Rio Grande - FURG, Brazil
Gabriel Wittum, Goethe University Frankfurt, Germany
Mudasser F. Wyne, National University, USA
Cong-Cong Xing, Nicholls State University, USA
Feng Yan, University of Nevada, Reno, USA
Carolina Yukari Veludo Watanabe, Federal Unversity of Rondônia, Brazil
Michael Zapf, Technische Hochschule Nürnberg Georg Simon Ohm (University of Applied Sciences Nuremberg), Germany
Vesna Zeljkovic, Lincoln University, USA
Ruochen Zeng, NXP Semiconductors, USA
Penghui Zhang, Arizona State University, USA
Qian Zhang, Liverpool John Moores University, UK

Technical Co-Sponsors and Logistic Supporters