The Eleventh International Conference on Advances in Circuits, Electronics and Micro-electronics

CENICS 2018

September 16, 2018 to September 20, 2018 - Venice, Italy

Deadlines

Submission

Jun 03, 2018

Notification

Jul 03, 2018

Registration

Jul 16, 2018

Camera ready

Jul 22, 2018

Deadlines differ for special tracks. Please consult the conference home page for special tracks Call for Papers (if any).

Publication

Published by IARIA Press (operated by Xpert Publishing Services)

Archived in the Open Access IARIA ThinkMind Digital Library

Prints available at Curran Associates, Inc.

Authors of selected papers will be invited to submit extended versions to a IARIA Journal

Indexing Procedure

Affiliated Journals

CENICS 2018 - The Eleventh International Conference on Advances in Circuits, Electronics and Micro-electronics

September 16, 2018 - September 20, 2018

CENICS 2018: Awards

The papers listed below have been selected as "Best Papers" based on the reviews of the original submission, the camera-ready version, and the presentation during the conference. For the awarded papers, a digital award will be issued in the name of the authors. The authors of these papers are also receiving invitations to submit an extended article version to one of the IARIA Journals.

Awarded Papers

Ultra-Low-Voltage Dual-Rail NAND/NOR for High Speed Processing
Ole Herman Schumacher Elgesem, Omid Mirmotahari, Yngvar Berg

 

The following papers have been selected on the basis of their contents, specificaly for lending themselves to an interesting extended work. The authors of these papers are receiving invitations to submit an extended article version to one of the IARIA Journals.

Papers Invited for IARIA Journals

Real-Time SDR-Based ISM-Multiantenna Receiver for DoA-Applications
Janos Buttgereit, Erik Volpert, Horst Hartmann, Dirk Fischer, Götz C. Kappen, Tobias Gemmeke

A New Front-End Readout Electronics for the ALICE Charged-Particle Veto Detector
Clive Seguna, Edward Gatt, Giacinto De Cataldo, Ivan Grech, Owen Casha

Technical Co-Sponsors and Logistic Supporters