The Ninth International Conference on Smart Portable, Wearable, Implantable and Disability-oriented Devices and Systems

SPWID 2023

June 26, 2023 to June 30, 2023 - Nice, Saint-Laurent-du-Var, France

Deadlines

Submission

Apr 07, 2023

Notification

May 05, 2023

Registration

May 19, 2023

Camera ready

May 26, 2023

Deadlines differ for special tracks. Please consult the conference home page for special tracks Call for Papers (if any).

Publication

Published by IARIA Press (operated by Xpert Publishing Services)

Archived in the Open Access IARIA ThinkMind Digital Library

Prints available at Curran Associates, Inc.

Authors of selected papers will be invited to submit extended versions to a IARIA Journal

Indexing Procedure

Affiliated Journals

SPWID 2023 - The Ninth International Conference on Smart Portable, Wearable, Implantable and Disability-oriented Devices and Systems

June 26, 2023 - June 30, 2023

SPWID 2023: Committees
Due to the holiday season and requests from contributors the submission site remains open.
Onsite and Online Options: In order to accommodate a large number of situations, we are offering the option for either physical presence or virtual participation (pdf slides or pre-recorded videos).

SPWID 2023 Steering Committee

Steve Mann
Stanford University
USA


Mu-Chun Su
National Central University
Taiwan


Andrea Caroppo
National Research Council of Italy (CNR) - Institute for Microelectronics and Microsystems
Italy


 

 

 

SPWID 2023 Publicity Chairs

Sandra Viciano Tudela, Universitat Politecnica de Valencia, Spain
José Miguel Jiménez, Universitat Politecnica de Valencia, Spain

 

SPWID 2023 Technical Program Committee

Zaid Ahmad, COMSATS University Islamabad, Pakistan
Giovanni Albani, Istituto Auxologico Italiano - IRCCS, Italy
Jesús B. Alonso Hernández, Institute for Technological Development and Innovation in Communications (IDeTIC) | University of Las Palmas de Gran Canaria (ULPGC), Spain
Salzitsa Anastasova-Ivanova, Imperial College London, UK
Danilo Avola, Sapienza University, Rome, Italy
Suhaib Ahmed Batt, Baba Ghulam Shah Badshah University, India
Roberto Beghi, Università degli Studi di Milano, Italy
Juan-Vicente Capella-Hernández, Universitat Politècnica de València, Spain
Andrea Caroppo, National Research Council of Italy (CNR) - Institute for Microelectronics and Microsystems, Italy
Claude Chaudet, Webster University Geneva, Switzerland
Francesco G. Della Corte, University of Napoli Federico II, Italy
Abdelali Elmoufidi, University of Hassan II Casablanca, Morocco
Biyi Fang, Microsoft, USA
Shayan Fazeli, UCLA Henry Samueli School of Engineering and Applied Science, USA
Giancarlo Fortino, University of Calabria, Italy
Arfan Ghani, Coventry University, UK
Migyeong Gwak, University of California - Los Angeles (UCLA), USA
Gema Ibáñez, ITACA - Universitat Politècnica de València, Spain
Jk Jensen, Arizona State University, USA
Pradeep Kumar, University of KwaZulu-Natal, Durban, South Africa
Tomas Laurenzo, University of Colorado at Boulder, USA
Alessandro Leone, National Research Council of Italy, Lecce, Italy
Lenka Lhotska, Czech Institute of Informatics, Robotics and Cybernetics | Czech Technical University in Prague, Czech Republic
Cun Li, Eindhoven University of Technology, Netherlands
Tianliang Li, Wuhan University of Technology, China
Steve Mann, Stanford University, USA
Tauheed Khan Mohd, Augustana College, USA
Gregory O'Hare, University College Dublin (UCD), Ireland
Ilham El Ouariachi, University Sidi Mohamed Ben Abdellah, Fez, Morocco
Luana Persano, Institute of Nanoscience - CNR, Pisa, Italy
Chinthaka Premachandra, Shibaura Institute of Technology, Japan
Amir Rahmati, Stony Brook University, USA
Veronica Mattioli, Univeristy of Parma, Italy
Helder C. R. Oliveira, University of Calgary, Canada
Juha Röning, University of Oulu, Finland
Gonzalo Sad, CIFASIS / CONICET / FCEIA | Universidad Nacional de Rosario, Argentina
Mu-Chun Su, National Central University, Taiwan
Ryszard Tadeusiewicz, AGH University of Science and Technology, Poland
Adrian Tarniceriu, Securecell SA, Switzerland
Carlos M. Travieso-González, University of Las Palmas de Gran Canaria, Spain
Warner ten Kate, Philips Research, Eindhoven, Netherlands
Wang Wen, Institute of Acoustics - Chinese Academy of Sciences, China
Diane Woodbridge, University of San Francisco, USA
Murat Kaya Yapici, Sabanci University, Istanbul, Turkey

Technical Co-Sponsors and Logistic Supporters