The Fourth International Conference on Smart Portable, Wearable, Implantable and Disability-oriented Devices and Systems

SPWID 2018

July 22, 2018 to July 26, 2018 - Barcelona, Spain

Deadlines

Submission

Mar 05, 2018

Notification

May 07, 2018

Registration

May 21, 2018

Camera ready

Jun 08, 2018

Publication

Published by IARIA XPS Press

Archived in the free access ThinkMind Digital Library

Prints available at Curran Associates, Inc.

Authors of selected papers will be invited to submit extended versions to a IARIA Journal

Affiliated Journals

SPWID 2018 - The Fourth International Conference on Smart Portable, Wearable, Implantable and Disability-oriented Devices and Systems

July 22, 2018 - July 26, 2018

SPWID 2018: Committees

SPWID Steering Committee

Marius Silaghi, Florida Institute of Technology, USA
Jun-Dong Cho, SungKyunKwan University, Korea
Lenka Lhotska, Czech Institute of Informatics, Robotics and Cybernetics | Czech Technical University in Prague, Czech Republic

SPWID Industry/Research Advisory Committee

Warner ten Kate, Philips Research, the Netherlands

SPWID 2018 Technical Program Committee

Giovanni Albani, Istituto Auxologico Italiano - IRCCS, Verbania, Italy
Jesús B. Alonso Hernández, Institute for Technological Development and Innovation in Communications (IDeTIC) | University of Las Palmas de Gran Canaria (ULPGC), Spain
Viacheslav Antsiperov, Kotel'nikov Institute of Radio-engineering and Electronics (IRE) of Russian Academy of Sciences (RAS), Russia
Rohan Banerjee, Tata Consultancy Services, India
Katharina Bredies, University of the Arts Berlin, Germany
Amitava Chatterjee, Jadavpur University, Kolkata, India
Jun-Dong Cho, SungKyunKwan University, Korea
Cesario Di Sarno, COSIRE Group, Aversa, Italy
Dermot Diamond, Dublin City University, Ireland
Ramin Fallahzadeh, Washington State University, USA
Biyi Fang, Michigan State University, USA
Alessia Garofalo, COSIRE Group, Aversa, Italy
Vivian Genaro Motti, George Mason University, USA
Arfan Ghani, Coventry University, UK
Athanasios Gkelias, Imperial College London, UK
Chris Gniady, University of Arizona, USA
Raffaele Gravina, University of Calabria, Italy
Jan Havlík, Czech Technical University in Prague, Czech Republic
Carmen Horrillo Güemes, Instituto de Tecnologías Físicas y de la Información (ITEFI) | Consejo Superior de Investigaciones Científicas (CSIC), Spain
Gema Ibáñez Sánchez, ITACA - Universitat Politècnica de València, Spain
Ki-Il Kim, Chungnam National University, Republic of Korea
Andrew Kusiak, University of Iowa, USA
Lenka Lhotska, Czech Institute of Informatics, Robotics and Cybernetics | Czech Technical University in Prague, Czech Republic
Feng Lin, University at Buffalo, USA
Jindong Liu, Imperial College London, UK
Jiang Lu, University of Houston - Clear Lake, USA
Parbati Kumar Manna, Intel Corporation, USA
Abhinav Mehrotra, University College London, University of Birmingham, UK
Kunal Mitra, Florida Institute of Technology, USA
Hossein Mohamadipanah, University of Wisconsin - Madison, USA
Sugata Munshi, Jadavpur University, India
Tadashi Nakano, Osaka University, Japan
Gregory O'Hare, University College Dublin (UCD), Ireland
Veljko Pejović, University of Ljubljana, Slovenia
Mohammad Pourhomayoun, Cornell University, USA
Daniel Roggen, University of Sussex, UK
Seyed-Ali Rokni, Washington State University, USA
Ramyar Saeedi, Washington State University, USA
Osamu Saisho, NTT, Japan
Jacob Scharcanski, UFRGS - Universidade Federal do Rio Grande do Sul, Brazil
Pietro Siciliano, Institute for Microelectronics and Microsystems IMM-CNR, Lecce, Italy
Marius Silaghi, Florida Institute of Technology, USA
Mu-Chun Su, National Central University, Taiwan
Ryszard Tadeusiewicz, AGH University of Science and Technology, Krakow, Poland
Adrian Tarniceriu, PulseOn SA, Switzerland
Warner ten Kate, Philips Research, Netherlands
Vicente Traver, ITACA - Universitat Politècnica de València, Spain
Carlos M. Travieso-González, University of Las Palmas de Gran Canaria, Spain
Hui Wu, University of New South Wales, Australia
Kaikai Xu, University of Electronic Science and Technology of China, Chengdu, China
Qingxue Zhang, The University of Texas at Dallas, USA
Lihong Zheng, Charles Sturt University, Australia

Technical Co-Sponsors and Logistic Supporters