SPACOMM 2018 - The Tenth International Conference on Advances in Satellite and Space Communications
April 22, 2018 - April 26, 2018
SPACOMM 2018: Committees
SPACOMM Steering Committee
Timothy T. Pham, Jet Propulsion Laboratory - California Institute of Technology, USA
Stelios Papaharalabos, National Centre for Scientific Research "Demokritos", Greece
Cathryn Peoples, Ulster University & The Open University, UK
SPACOMM Industry/Research Advisory Committee
Michael Sauer, Corning Cable Systems, USA
Vittorio Dainelli, Rheinmetall Italia S.p.A., Italy
Brian Niehoefer, TÜV Informationstechnik GmbH, Germany
SPACOMM 2018 Technical Program Committee
Ashfaq Ahmed, COMSATS Institute of Information Technology - Wah campus, Pakistan
Mohamed Al-Mosawi, University of Portsmouth, UK
David N. Amanor, North Carolina A&T State University, USA
Michael Atighetchi, Raytheon BBN Technologies, USA
Arash Behboodi, RWTH Aachen University, Germany
Mark Bentum, University of Twente, Netherland
Maria Dolores Cano Baños, Universidad Politécnica de Cartagena. Spain
Genshe Chen, Intelligent Fusion Technology Inc., USA
Yao-Yi Chiang, University of Southern California, USA
Vittorio Dainelli, Rheinmetall Italia S.p.A., Italy
Peng Deng, The Pennsylvania State University, USA
Suleyman Eken, Kocaeli University, Turkey
Ibrahim Hokelek, TUBITAK BILGEM, Turkey
Suk-Seung Hwang, Chosun University, Korea
Adil Hakeem Khan, Nation College of Engineering and Tech., Guna MP, India
Emmanouel T. Michailidis, University of Piraeus, Greece
Kresimir Malaric, University of Zagreb, Croatia
Brian Niehoefer, TUV Informationstechnik GmbH, Germany
Nele Noels, University of Gent, Belgium
Krishna Pande, National Chiao Tung University, Taiwan
Stelios Papaharalabos, National Centre for Scientific Research "Demokritos", Athens, Greece
Cathryn Peoples, Ulster University & The Open University, UK
Timothy T. Pham, Jet Propulsion Laboratory - California Institute of Technology, USA
Ermanno Pietrosemoli, Abdus Salam International Centre for Theoretical Physics, Italy
Cong Pu, Marshall University, Huntington, USA
Vincent Roca, Inria research institute, France
Alexandru Rusu, University Politehnica of Bucharest, Romania
Michael Sauer, Corning Incorporated, USA
Cristian Stanciu, University Politehnica of Bucharest, Romania
Piotr Tyczka, ITTI Sp. z o.o., Poznań, Poland
Ouri Wolfson, University of Illinois, USA
Xiaozhou Yu, Northwestern Polytechnical University, China
Qiang Zhu, University of Michigan, USA